Building the Infrastructure for Holistic, End-To-End Manufacturing

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Abstract

As we rely more heavily on electronic devices in our daily lives, these products are becoming increasingly complex and customized. Companies are driven to generate constant innovations to compete in a limited, demanding and increasingly sophisticated market.

In this paper, we look briefly at some of the essentials needed to build a connected end-to-end manufacturing environment that can respond to today’s market challenges. We look at a real-world case study that implements this approach and discuss some of the ways Siemens helps manufacturers build a holistic PCB manufacturing and assembly operation.

What you get from this white paper

Benefits:

  • Explore the seven trends keeping manufacturing executives up at night

Download White Paper

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