This white paper looks at 10 areas where electronic and mechanical designers working with printed circuit boards (PCBs) face the dysfunctional nature of their collaborative tools. Leverage the powerful capabilities in NX and Siemens Xpedition for solutions to the following:
- External and internal copper and solder mask/silkscreen data
- True 3D model exchange and synchronization (pin 1 verification)
- Full 3D Interference checking
- Rigid-flex objects (multiple thickness boards, stiffeners, etc.)
- High density interconnects and miniaturization
- Variant exchange
- Design intent collaboration (ownership, frozen groups)
- Workflow synchronization
