Background:
During the co-simulation, PCB temperature results are passed into a DC drop analysis to better model copper trace electrical resistance changes with temperature, and then an updated joule heating power map from the PCB electrical net is fed into system-level thermal analysis.
On-Demand Webinar
Presenter: Gowrav Ravindra
PCB Validation: DC Drop – Thermal Co-Simulation for First Pass Design
Who Should Attend?
- PCB Designers
- Project Managers
- Power integrity & PCB Thermal specialists
Post the session, the participants will be able to:
- Learn how DC drop issues can affect your PCB design
- Analyze voltage drop due to supply plane copper losses
- Know DC drop /Thermal Co-simulation
ON-DEMAND
Presenter - Gowrav Ravindra
Gowrav has total of 10+ years of expertise handling PCB for High Power & High Voltage designs and High-Speed Design. Involved in layout design for applications in the area of Power Electronics, Custom Power Supplies, Analog Circuits, Digital Power, Solar and Renewable Energy, High-Speed Design differential pair min/max length matching – like DDR 2/3 boards. handling the portfolio of Mentor PCB software’s Pre-Sales & post Sales.