Simcenter Flotherm 2021.2: What’s New?

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Discover what’s new in Simcenter Flotherm 2021.2 electronics cooling software including:

  • Support for Xcelerator Share cloud based collaboration service
  • Enhanced conduction solver speed
  • BCI-ROM extraction improvements for reduced order modeling
  • EDA bridge automation functionality

What is Xcelerator Share? Now supported by Simcenter Flotherm 2021.2

Xcelerator Share is a cloud-based collaboration service that supports distributed working environments and is available with many Siemens software subscriptions. It is part of the Xcelerator Portfolio and provides:

  • Secure cloud storage with desktop syncing
  • Permission-based project sharing with task management
  • Engineering-centric view & markup
  • Any device, any time, browser-based access to data

Xcelerator Share is now supported by Simcenter Flotherm 2021.2. Leveraging Xcelerator Share allows you to set up collaboration projects, synchronize files to cloud storage directly from Simcenter Flotherm running on your desktop, send messages and receive notifications, and also review and mark up documents. This supports more easily working with engineering colleagues in different departments, different locations and even with external suppliers and consultants.

2 ways Xcelerator Share helps electronics thermal design processes

1) Xcelerator Share helps thermal analysis linkages to ECAD and MCAD workflows for distributed teams

Xcelerator Share is now supported by Simcenter Flotherm 2021.2. Leveraging Xcelerator Share allows you to set up collaboration projects, synchronize files to cloud storage directly from Simcenter Flotherm running on your desktop, send messages and receive notifications, and also review and mark up documents. This supports more easily working with engineering colleagues in different departments, different locations and even with external suppliers and consultants.

2) Leverage Xcelerator Share cloud based collaboration and Simcenter Flotherm automation to standardize and streamline PCB thermal analysis processes

Consider an electronics design department requiring multiple board layouts to be analyzed to find an optimum layout for thermal management. They require that the same thermal analysis process is performed on each layout and the generation of a consistent report format in each instance for ease of comparison. These teams may be in different timezones and locations and there are short project times.

Find out from this 7-minute detailed video insights on how to leverage Xcelerator Share for creating a collaborative environment and then applying Simenter Flotherm scripting capabilities to aid automated analysis steps and to create standardized reports.

The video illustrates capabilities within Simcenter Flotherm to record a Floscript macro of all steps within application windows to aid the automation of tasks. Since the previous Simcenter Flotherm 2021.1 release, this includes the ability to record macros in the EDA Bridge application window so you can capture commands to then automate import and processing of board files (e.g ODB++) with actions such as library component swap functions. The command aspects of setting up an analysis, finding components in complex board models, to post-processing and report output can also be recorded in a Floscript Macro. The Floscript recording can then be used as the basis to automate the overall process to enable analysis of multiple boards designs more efficiently. Those reports can then be shared in the Xcelerator Share project for review and mark up..

Go faster, explore the possibilities with Simcenter Flotherm 2021.2

Beyond new Xcelerator Share support, discover other areas below that help speed up analysis, or automate and standardize analysis tasks so you can explore more design options faster.

Improved conduction only solver enhances BCI-ROM extraction

An improved ‘conduction only’ solver to handle package or die models of extreme complexity is now available and up to 10x faster.

An improved BCI-ROM extraction helps accelerate the creation of reduced-order models (ROMs), especially at the highest accuracy settings.

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