Simcenter Understanding Die Attach Thermal Performance WP

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Power electronics components improve the energy efficiency of electricmachines and motors across all industries and applications. Increasinglythese power electronic components are being more densely packedtogether, positioned close to or on the motor itself, and so are affected by harshness and vibration in the application.

What you get from this white paper


  • Thermal Structure-Function analysis offers an effective and non-invasive method to identify the physical characteristics of the individual layers of a packaged device.
  • This technique complements other nondestructive failure analysis techniques such as X-ray and C-SAM that visibly identify defects, however, these techniques do not provide any information regarding the impact of these defects on the thermal behavior of the part.”

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