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Thermal Design Leads the Charge

Abstract

Thermal considerations affect both the electrical and mechanical nature of electronic devices. To gain insight into thermal efficiency problems and remove thermal hot spots in its power adapters, NXP Semiconductors’ Smart Power Division conducted simulations using SimcenterTM FlothermTM software.

In the case of the power adapters that NXP Semiconductors’ Smart Power Division are developing, thermal considerations have really come to the fore, driven by the trends we see in mobile power adaptors, which are getting smaller and have higher output power

What you get from this white paper

  • How to use thermal transient testing for the thermal characterization of power semiconductor packages.
  • How to calibrate a compact thermal model automatically for use in thermal simulation at the device level.
  • Checking for power cycling and diagnosis of failure for reliability assessment.

Download White Paper


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