fbpx

Unraveling the Complexities of Automotive Instrument Cluster Design

Abstract

This white paper describes the role of thermal requirements in automotive instrument clusters and their effect on the printed circuit board (PCB) and mechanical design. It explains how data from Siemens Expedition PCB design tools can be embedded in a SimcenterTM FlothermTM XT simulation model to investigate and optimize the entire thermal behavior of the instrument cluster. A comparison of the PCB layout thermal simulation results with thermography measurements prior to complete enclosure modeling is also addressed.

What you get from this white paper

Key Features:

  • PCB assembly modeling
  • Comparing experimental data and numerical results
  • Housing modeling

Download White Paper


Leave a Reply

Your email address will not be published. Required fields are marked *

Fill out this field
Fill out this field
Please enter a valid email address.

Menu